PSPI (Photosensitive Polyimide) for semiconductors is mainly used for DRAM and SYSTEM semiconductors,
and is also used for semiconductor WLP(Wafer Level Packaging).
PSPI used for semiconductor post-processing is used for
FI-WLP, FO-WLP, FC BGA / CSP bumping, redistribution (RDL) and stress buffer layer.
In particular, the photodefinable insulating film (PSPI) for semiconductor post-processing
that directly implements the photo-definable properties that enable fine patterns is used to prevent damage
during post-processing of the formed circuit and to prevent cracking after chip mounting.
